Amkor's AI and HPC Packaging Demand Grows: Can Growth Continue?

AMKR posted record Q2 2026 revenue of $1.90 billion, up 26% year-over-year, driven by AI and data-center demand. The packaging specialist is advancing 2.5D, HDFO, and co-packaged optics technologies through partnerships with TSM and NVIDIA.

The company guided Q3 sales to $1.95-$2.05 billion with gross margins between 18.5% and 19.5%. AMKR also announced a $12 billion Phase 2 expansion of its Arizona campus, signaling confidence in sustained AI infrastructure buildout.

The advanced packaging market is heating up as competitors race to capture AI and high-performance computing share. TSM and INTC are both investing heavily in advanced packaging capabilities, intensifying the competition for what has become a critical bottleneck in AI chip production.

AMKR's positioning in 2.5D and advanced packaging puts it at the intersection of two tailwinds: surging AI chip demand and the technical shift toward chiplet architectures that require sophisticated packaging solutions.